内容简介

  《化合物半导体加工中的表征(英文)》的主要内容包括:PrefacetotheReissueoftheMaterialsCharacterizationSeriesix;PrefacetoSeriesx;PrefacetotheReissueofCharacterizationofCompoundSemiconductorProcessingxi;Prefacexiii;Contributorsxv等。

目录

PrefacetotheReissueoftheMaterialsCharacterizationSeriesix
PrefacetoSeriesx
PrefacetotheReissueofCharacterizationofCompound
SemiconductorProcessingxi
Prefacexiii
Contributorsxv
CHARACTERIZATIONOFIII—VTHINFILMSFOR
ELECTRONICDEVICES
III—VCOMPOUNDSEMICONDUCTORFILMSFOR
OPTICALAPPLICATIONS
CONTACTS
DIELECTRICINSULATINGLAYERS
OTHERCOMPOUNDSEMICONDUCTORFILMS
DEEPLEVELTRANSIENTSPECTROSCOPY:ACASESTUDY
ONGaAs
APPENDIX:TECHNIQUESUMMARIES

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