内容简介
《化合物半导体加工中的表征(英文)》的主要内容包括:PrefacetotheReissueoftheMaterialsCharacterizationSeriesix;PrefacetoSeriesx;PrefacetotheReissueofCharacterizationofCompoundSemiconductorProcessingxi;Prefacexiii;Contributorsxv等。
目录
PrefacetotheReissueoftheMaterialsCharacterizationSeriesix
PrefacetoSeriesx
PrefacetotheReissueofCharacterizationofCompound
SemiconductorProcessingxi
Prefacexiii
Contributorsxv
CHARACTERIZATIONOFIII—VTHINFILMSFOR
ELECTRONICDEVICES
III—VCOMPOUNDSEMICONDUCTORFILMSFOR
OPTICALAPPLICATIONS
CONTACTS
DIELECTRICINSULATINGLAYERS
OTHERCOMPOUNDSEMICONDUCTORFILMS
DEEPLEVELTRANSIENTSPECTROSCOPY:ACASESTUDY
ONGaAs
APPENDIX:TECHNIQUESUMMARIES